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MITSUMI
microSD card connectors
CIM-H33N
Connectors
FEATURES
1. Hinge machanism type 2. Small and tin design 3. Prevents from losing card by attaching a card to the plate at card attachment and removal. 4. Card attachment and removal is easy by plate opening with spring force. 5. Contact slide on card pad at card setting with self-cleaning mechanism. 6. ESD countermeasure is possible at card attachment.
HOW TO ORDER
H33N-008-21 0 - A G G E
1 1 2 3 4 5 6 7 8 2 3 4 5 6 78 Series No. (H33N : Nomal type) No. of contacts (008 : 8pins) Housing material (21 : LCP resin) Housing UL grade (0 : UL94V-0) Contact plating (A : Gold) Contact plating thickness (G : 3m) Contact read style (G : Angle SMT) Package (E : Taping)
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS Rated Voltage Rated Current Withstanding Voltage Insulation Resistance Contact Resistance MECHANICAL CHARACTERISTICS Life (Matching Cycle) Using Temperature Range 10,000times -25~+85C AC 50V (rms) 0.5A 500V AC (rms) 1minute 1000M min. (Initial value) 100m max. (Initial value)
MITSUMI
microSD card connectors
MATERIAL & FINISH
Component Parts Housing Contact Plate Lock Spring Wing Shaft Torsion Spring Material LCP resin Copper Alloy SUS Copper Alloy Copper Alloy SUS SUS Finish (Black) Gold plating
-
Gold plating Gold plating
-
DIMENSIONS
14 0.55 0.25 2.2 2.15
0.4
0.4
(1.5) Slide stroke
2.5
16.9
0.4
8.3
Slide
12.1
12.1
#1
#8
(13)
2.7
5.7
0.6
0.6
1.9
0.3 1.1 7.7
Slide unlock
0.4
0.4
2.15
0.55
13.75
0.55
Slide lock
Recommended PWB layout
1.7 10.1 9.625 0.5 Note [For GND] 1 1.65
OPE.1 Card insert
1
1.4
8.35
1.7
11.5
9.4
0.9
0.9
OPE.2 Plate close
1
12.1
2.7
1
1.7
1.1 1.3 7.7 10.76 1.7
1
4.8 5
5.4
0.9
OPE.3 Plate slide
OPE.4 Slide lock position
5.9
6.3

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